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Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX25CEC
Rev. 9, 06/2012
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Case 2107 12 x 12 mm, 0.5 mm Pitch
Ordering Information
See Table 1 on page 3 for ordering information.
© 2012 Freescale Semiconductor, Inc. All rights reserved.
1 Introduction
The i.MX25 multimedia applications processor has
the right mix of high performance, low power, and
integration to support the growing needs of the
industrial and general embedded markets.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM926EJ-S core, with speeds of up to 400 MHz.
The i.MX25 includes support for up to 133 MHz
DDR2 memory, integrated 10/100 Ethernet MAC,
and two on-chip USB PHYs. The device is suitable
for a wide range of applications, including the
following:
Graphical remote controls
Human Machine Interface (HMI)
Residential and commercial control panels
Residential gateway (smart metering)
Handheld scanners and printers
Electronic point-of-sale terminals
Patient-monitoring devices
i.MX25 Applications
Processor for
Consumer and
Industrial Products
Silicon Version 1.2
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 19
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24
3.7. Module Timing and Electrical Parameters . . . . . . 41
4. Package Information and Contact Assignment . . . . . . 124
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125
4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135
4.5. 347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch 138
4.6. Ground, Power, Sense, and Reference Contact
Assignments Case 12x12 mm, 0.5 mm Pitch . . . 139
4.7. Signal Contact Assignments12 x 12 mm, 0.5 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
4.8. i.MX25 12x12 Package Ball Map . . . . . . . . . . . . 148
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
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Podsumowanie treści

Strona 1 - Industrial Products

Freescale SemiconductorData Sheet: Technical DataDocument Number: IMX25CECRev. 9, 06/2012MCIMX25Package InformationPlastic packageCase 5284 17 x 17 mm

Strona 2 - 2 Freescale Semiconductor

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 910 Freescale Semiconductor MESH_C, MESH_D Wire-mesh tamper detect pins that

Strona 3 - 1.1 Ordering Information

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9100 Freescale Semiconductor Figure 73. Boundary Scan (JTAG) Timing DiagramFi

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 101 Figure 75. TRST Timing DiagramTable 78. SJC Timi

Strona 5 - 1.2 Block Diagram

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9102 Freescale Semiconductor 3.7.16 Smart Liquid Crystal Display Controller (

Strona 6 - 2Features

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 103 Figure 77. SLCDC Timing Diagram—Parallel Transfe

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9104 Freescale Semiconductor 3.7.17 Synchronous Serial Interface (SSI) Timing

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 105 Note: • All the timings for the SSI are given

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9106 Freescale Semiconductor 3.7.17.2 SSI Receiver Timing with Internal Clock

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 107 Note: • All the timings for the SSI are given

Strona 11 - 3 Electrical Characteristics

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9108 Freescale Semiconductor Note: • All the timings for the SSI are given

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 109 3.7.17.4 SSI Receiver Timing with External Clock

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 11 3 Electrical CharacteristicsThis section provides

Strona 14 - 3.1.6 Power Modes

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9110 Freescale Semiconductor • ”Tx” and “Rx” refer, respectively, to the tra

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 111 3.7.18.2 ADC Timing DiagramsFigure 82 represents

Strona 16 - 3.2.1 Power-Up Sequence

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9112 Freescale Semiconductor assertion of soc is detected. Thus, if the soc s

Strona 17 - 3.2.2 Power-Down Sequence

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 113 Figure 83 shows the timing for ADC normal operat

Strona 18 - 3.3 Power Characteristics

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9114 Freescale Semiconductor Figure 84 represents the usage of the ADC with i

Strona 19 - 3.4 Thermal Characteristics

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 115 3.7.19.1 UART RS-232 Serial Mode Timing3.7.19.1.

Strona 20 - 3.5 I/O DC Parameters

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9116 Freescale Semiconductor 3.7.19.2 UART Infrared (IrDA) Mode TimingThe fol

Strona 21 - 1.8V (± 5%) applications

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 117 3.7.20 USBOTG TimingThis section describes timin

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9118 Freescale Semiconductor Figure 90 shows the USB receive waveform in DAT_

Strona 23 - 3.5.2 GPIO I/O DC Parameters

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 119 Figure 91 shows the USB transmit waveform in DAT

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 912 Freescale Semiconductor I/O supply voltage, GPIOCRM,LCDC,JTAG,MISCNVDD_GP

Strona 25 - Freescale Semiconductor 25

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9120 Freescale Semiconductor 3.7.20.1.3 VP_VM Bidirectional Mode TimingTable

Strona 26 - 3.6.1 Slow I/O AC Parameters

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 121 Table 95 shows the USB port timing specification

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9122 Freescale Semiconductor Figure 95 shows the USB transmit waveform in VP_

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 123 Table 97 shows the timing specifications for USB

Strona 29 - 3.6.2 Fast I/O AC Parameters

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9124 Freescale Semiconductor Figure 97 shows the USB parallel mode transmit/r

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 125 Figure 98. zzxz17×17 i.MX25 Production Package4.

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9126 Freescale Semiconductor NVCC_DRYICE1W11NVCC_EMI1 G6, G7, G8, G9, H6, H7,

Strona 32 - 3.6.3 DDR I/O AC Parameters

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 127 4.3 Signal Contact Assignments—17 x 17 mm, 0.8 m

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9128 Freescale Semiconductor SD3 D14 EMI1 DDR INPUT KeeperSD4 D13 EMI1 DDR IN

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 129 CS3 A17 EMI2 DDR OUTPUT HighCS4 D5 EMI1 GPIO OUT

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 13 3.1.3 Fusebox Supply Current ParametersTable 7 li

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9130 Freescale Semiconductor LD22W7 LCDC GPIO OUTPUT LowLD32U8 LCDC GPIO OUTP

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 131 I2C1_CLK F17 CSI GPIO INPUT 100 KΩ Pull-UpI2C1_D

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9132 Freescale Semiconductor FEC_TDATA0 L3 MISC GPIO OUTPUT HighFEC_TDATA1 J4

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 133 VSTBY_ACK3T20 CRM GPIO OUTPUT LowPOWER_FAIL T19

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9134 Freescale Semiconductor Table 102 lists the 17×17 mm package i.MX25 no c

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 135 4.4 i.MX25 17x17 Package Ball MapTable 103 shows

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9136 Freescale Semiconductor KQGNDQGNDQGNDQGNDQGNDQVDDQVDDQGNDQGNDQGNDQGNDQVD

Strona 43 - 3.7.2 ATA Timing Parameters

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 137 UUART1_TXDUART1_RXDCSPI1_SCLKCONTRASTLSCLKVSYNCH

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9138 Freescale Semiconductor 4.5 347 MAPBGA—Case 12 x 12 mm, 0.5 mm PitchFigu

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 139 4.6 Ground, Power, Sense, and Reference Contact

Strona 46 - 46 Freescale Semiconductor

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 914 Freescale Semiconductor 3.1.5 USB_PHY Current ConsumptionTable 11 provide

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9140 Freescale Semiconductor 4.7 Signal Contact Assignments—12 x 12 mm, 0.5 m

Strona 48 - 48 Freescale Semiconductor

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 141 A20 B6 EMI1 DDR OUTPUT LowA21 D7 EMI1 DDR OUTPUT

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9142 Freescale Semiconductor SDCLK_B D14 EMI2 DDR OUTPUT HighSDQS0 E14 EMI2 D

Strona 50 - 50 Freescale Semiconductor

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 143 D7 L1 NFC GPIO INPUT KeeperD6 K1 NFC GPIO INPUT

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9144 Freescale Semiconductor CSI_D3 F19 CSI GPIO INPUT KeeperCSI_D4 E21 CSI G

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 145 UART2_RTS T2 MISC GPIO INPUT 100 KΩ Pull-UpUART2

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9146 Freescale Semiconductor FEC_RDATA0 M4 MISC GPIO INPUT 100 KΩ Pull-DownFE

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 147 GPIO_E R21 CRM GPIO INPUT 100 KΩ Pull-UpGPIO_F R

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9148 Freescale Semiconductor Table 106 lists the 12×12 mm package i.MX25 no c

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 149 GD2D8NFWP_BNFRBQGNDQVDDNVCC_EMI1NVCC_EMI1NVCC_EM

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 15 Table 13 shows typical current consumption for th

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9150 Freescale Semiconductor RFEC_TX_ENKPP_ROW0KPP_ROW1UART1_CTSNVCC_MISCNVCC

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 151 5 Revision HistoryTable 108 summarizes revisions

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9152 Freescale Semiconductor Rev. 3 03/2010 • Updated Ta bl e 1 , “Ordering

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Document Number: IMX25CECRev. 906/2012How to Reach Us:Home Page: www.freescale.com Web Support: http://www.freescale.com/supportUSA/Europe or Location

Strona 62 - CK 7.5 8 ns

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 916 Freescale Semiconductor 3.2 Supply Power-Up/Power-Down Requirements and R

Strona 63 - CK, CK Differential Slew Rate

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 17 Figure 2 shows the power-up sequence diagram. Aft

Strona 64 - DQM (output)

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 918 Freescale Semiconductor NOTEThis is to guarantee that analog peripherals

Strona 65 - DQ (input)

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 19 The method for obtaining the maximum current is a

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 92 Freescale Semiconductor Features of the i.MX25 processor include the follo

Strona 67 - ≈ 33 MHz

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 920 Freescale Semiconductor 3.5 I/O DC ParametersThis section includes the DC

Strona 68 - (continued)

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 21 3.5.1.1 DDR_TYPE = 00 Standard Setting DDR I/O DC

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 922 Freescale Semiconductor 3.5.1.3 DDR_TYPE = 10 Max Setting DDR I/O DC Para

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 23 3.5.2 GPIO I/O DC ParametersTable 20 shows the I/

Strona 71 - WSC=1, EBWA=1, EBWN=1, LBN=1

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 924 Freescale Semiconductor 3.6 AC Electrical CharacteristicsThis section pro

Strona 72 - WSC=2, SYNC=1, DOL=0

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 25 Figure 5. Output Pad Propagation and Transition T

Strona 73 - WSC=7, LBA=1, LBN=1, LAH=1

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 926 Freescale Semiconductor 3.6.1 Slow I/O AC ParametersTable 21 shows the sl

Strona 74 - 74 Freescale Semiconductor

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 27 Output enable to output valid delay1 (max. drive)

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 928 Freescale Semiconductor Output pad dI/dt3 (max. drive) tdit 3.0–3.6 V3.0–

Strona 76 - Addr. V1

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 29 3.6.2 Fast I/O AC ParametersTable 22 shows the fa

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 3 1.1 Ordering InformationTable 1 provides ordering

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 930 Freescale Semiconductor Table 23 shows the fast I/O AC parameters for OVD

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 31 Output Pad Propagation Delay1 (High Drive), 50%–5

Strona 80 - 80 Freescale Semiconductor

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 932 Freescale Semiconductor 3.6.3 DDR I/O AC ParametersThe DDR pad type is co

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 33 Output pad propagation delay1 (high drive), 40%–6

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 934 Freescale Semiconductor Table 25 shows the AC parameters for mobile DDR p

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 35 Table 26 shows the AC requirements for mobile DDR

Strona 84 - Figure 54. eSDHCv2 Timing

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 936 Freescale Semiconductor 3.6.3.2 DDR_TYPE = 01 SDRAM I/O AC Parameters and

Strona 85 - 3.7.9.1 FEC MII Mode Timing

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 37 Table 28 shows AC parameters for SDRAM pbijtov18_

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 938 Freescale Semiconductor Output pad propagation delay1 (high drive), 40%–6

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 39 3.6.3.3 DDR_TYPE = 10 Max Setting I/O AC Paramete

Strona 88 - 3.7.9.3 RMII Mode Timing

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 94 Freescale Semiconductor Table 2 shows the functional differences between t

Strona 89 - VIL —0.4 — V

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 940 Freescale Semiconductor Table 31 shows the AC requirements for DDR2 I/O.O

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 41 3.7 Module Timing and Electrical ParametersThis s

Strona 91 - C) Timing

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 942 Freescale Semiconductor Figure 9 and Figure 10 show write 1 and read sequ

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 43 3.7.2 ATA Timing ParametersTable 35 shows paramet

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 944 Freescale Semiconductor 3.7.2.1 PIO Mode Timing ParametersFigure 11 shows

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 45 Figure 12 gives timing waveforms for PIO write mo

Strona 95 - Figure 67. PWM Timing

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 946 Freescale Semiconductor 3.7.2.2 Multiword DMA (MDMA) Mode TimingFigure 13

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 47 To meet timing requirements, a number of timing p

Strona 97 - 3.7.14.1 SIM Reset Sequences

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 948 Freescale Semiconductor 3.7.2.3.1 UDMA In-Transfer TimingFigure 15 shows

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 49 Figure 17 shows timing for device-terminated UDMA

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 5 1.2 Block DiagramFigure 1 shows the simplified int

Strona 100 - 100 Freescale Semiconductor

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 950 Freescale Semiconductor 3.7.2.4 UDMA Out-Transfer TimingFigure 18 shows t

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 51 Timing parameters for UDMA out-bursts are listed

Strona 102 - 102 Freescale Semiconductor

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 952 Freescale Semiconductor 3.7.4.1 Gated Clock Mode TimingFigure 20 and Figu

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 53 3.7.4.2 Ungated Clock Mode TimingFigure 22 shows

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 954 Freescale Semiconductor 3.7.5 Configurable Serial Peripheral Interface (C

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 55 3.7.6 External Memory Interface (EMI) TimingThe E

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 956 Freescale Semiconductor 3.7.6.1 ESDCTL Electrical Specifications3.7.6.1.1

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 57 Figure 26. SDR SDRAM Write Cycle Timing DiagramSD

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 958 Freescale Semiconductor Figure 27. SDRAM Refresh Timing DiagramTable 45.

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 59 Figure 28. SDRAM Self-Refresh Cycle Timing Diagra

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 96 Freescale Semiconductor 2FeaturesTable 3 describes the digital and analog

Strona 111 - 3.7.18.2 ADC Timing Diagrams

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 960 Freescale Semiconductor 3.7.6.1.2 Mobile DDR SDRAM–Specific ParametersThe

Strona 112 - Figure 82. Start-up Sequence

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 61 Figure 30. Mobile DDR SDRAM DQ versus DQS and SDC

Strona 113 - Freescale Semiconductor 113

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 962 Freescale Semiconductor 3.7.6.1.3 DDR2 SDRAM–Specific ParametersThe follo

Strona 114 - 3.7.19 UART Timing

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 63 Table 50 shows values for a command/address slew

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 964 Freescale Semiconductor Figure 32. DDR2 SDRAM Write Cycle Timing DiagramT

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 65 Figure 33. DDR2 SDRAM DQ vs. DQS and SDCLK READ

Strona 117 - 3.7.20 USBOTG Timing

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 966 Freescale Semiconductor 3.7.6.2 NAND Flash Controller (NFC) TimingThe i.M

Strona 118 - USB_TXOE_B

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 67 Figure 36. Write Data Latch Cycle Timing DiagramF

Strona 119

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 968 Freescale Semiconductor NOTEFor timing purposes, transition to signal hig

Strona 120 - bidirectional mode signals

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 69 Figure 38. WEIM Bus Timing DiagramTable 56. WEIM

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 7 EPIT(2) Enhanced periodic interrupt timerTimer per

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 970 Freescale Semiconductor NOTEThe test condition load capacitance was 25 pF

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 71 Figure 39 through Figure 44 give examples of basi

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 972 Freescale Semiconductor Figure 41. Synchronous Memory Timing Diagram for

Strona 125 - Case 17x17 mm, 0.8 mm Pitch

i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 73 Figure 42. Synchronous Memory TIming Diagram for

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 974 Freescale Semiconductor Figure 44. Muxed A/D Mode Timing Diagram for Sync

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 75 Figure 46. Asynchronous A/D Muxed Read Access (RW

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 976 Freescale Semiconductor Figure 48. Asynchronous A/D Mux Write AccessFigur

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 77 WE32A(muxed A/D CS[x] valid to Address Invalid WE

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 978 Freescale Semiconductor NOTEAll configuration parameters (CSA, CSN, EBWA,

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 79 3.7.7 Enhanced Serial Audio Interface (ESAI) Timi

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 98 Freescale Semiconductor I2C(3) I2C module Connectivity peripheralsInter-IC

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 980 Freescale Semiconductor Figure 51 shows the ESAI receive timing diagram.F

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 81 Figure 53 shows the ESAI HCKR timing diagram.Figu

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 982 Freescale Semiconductor 65 SCKR rising edge to FSR out (bl) high — — ——17

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 83 3.7.8 Enhanced Secured Digital Host Controller (e

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 984 Freescale Semiconductor Figure 54. eSDHCv2 TimingTable 61. eSDHCv2 Interf

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 85 3.7.9 Fast Ethernet Controller (FEC) TimingThe FE

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 986 Freescale Semiconductor 3.7.9.1.5 MII Transmit Signal Timing (FEC_TXD[3:0

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 87 1 FEC_COL has the same timing in 10-Mbit 7-wire i

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 988 Freescale Semiconductor 3.7.9.3 RMII Mode TimingIn RMII mode, FEC_TX_CLK

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 89 3.7.10 Controller Area Network (FlexCAN) Transcei

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 9 2.1 Special Signal ConsiderationsSpecial signal co

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 990 Freescale Semiconductor Figure 61. Timing Diagram for FlexCAN Standby Sig

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 91 3.7.11 Inter IC Communication (I2C) TimingThe I2C

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 992 Freescale Semiconductor 1A device must internally provide a hold time of

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 93 3.7.12 Liquid Crystal Display Controller (LCDC) T

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 994 Freescale Semiconductor Figure 66. LCDC TFT Mode Timing Diagram3.7.13 Pul

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 95 Figure 67. PWM Timing3.7.14 Subscriber Identity M

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 996 Freescale Semiconductor Figure 68. SIM Clock Timing DiagramTable 74 defin

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 97 3.7.14.1 SIM Reset SequencesSIM cards may have in

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 998 Freescale Semiconductor Figure 70. Active-Low-Reset SIM Card Reset Sequen

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i.MX25 Applications Processor for Consumer and Industrial Products, Rev. 9Freescale Semiconductor 99 Figure 71. SmartCard Interface Power Down AC Timi

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